The electrical signal test mainly uses the high-frequency digital oscilloscope as the main test equipment, combined with the high-frequency differential probe to measure the electrical signal of the storage product.

The main test items of high-precision oscilloscope are "signal capture", "signal analysis", "eye map measurement", "power integrity", "signal integrity" and so on.

Through the complete signal capture, signal analysis, eye map measurement functions, can meet the needs of DRAM, DDR, UFS, eMMC, SSD and other product lines of communication signal physical layer analysis. Ensure that the product signal meets the standard requirements, which greatly improves the reliability of the product application. Moreover, failure analysis can be performed, and SIPI anomalies can be caught for in-depth analysis and rectification.

PCB, tin ball size observation mainly with xx oscilloscope as the main equipment, through the optical microscope and computer, directly on the display to observe the metallographic graphics, and support the metallographic surface measurement and anomaly analysis.

Metallographic microscope is mainly used to accurately measure the size of objects, supporting the measurement of length, Angle, radian, circle, polygon and center distance. Clearly observe the object to be measured, adjust the light field according to demand, support bright, dark, polarizing field, filter field switch adjustment, observe PAD and Banding patterns, metal scratches, PCB wiring and other conditions, observe screen printing, tin ball size, ball micro-damage, foreign bodies, large balls and other phenomena.

The main test items of high-precision oscilloscope are "signal capture", "signal analysis", "eye map measurement", "power integrity", "signal integrity" and so on.

Through the complete signal capture, signal analysis, eye map measurement functions, can meet the needs of DRAM, DDR, UFS, eMMC, SSD and other product lines of communication signal physical layer analysis. Ensure that the product signal meets the standard requirements, which greatly improves the reliability of the product application. Moreover, failure analysis can be performed, and SIPI anomalies can be caught for in-depth analysis and rectification.

The electrical signal test mainly uses the high-frequency digital oscilloscope as the main test equipment, combined with the high-frequency differential probe to measure the electrical signal of the storage product.

The main test items of high-precision oscilloscope are "signal capture", "signal analysis", "eye map measurement", "power integrity", "signal integrity" and so on.

Through the complete signal capture, signal analysis, eye map measurement functions, can meet the needs of DRAM, DDR, UFS, eMMC, SSD and other product lines of communication signal physical layer analysis. Ensure that the product signal meets the standard requirements, which greatly improves the reliability of the product application. Moreover, failure analysis can be performed, and SIPI anomalies can be caught for in-depth analysis and rectification.

Protocol analysis mainly takes protocol analyzer as the main test equipment, and can analyze CTS through the capture and analysis of M-PHY 5.0, Unipro 2.0, UFS 4.0, eMMC 5.1 and other protocols.

The protocol analyzer mainly supports test items such as "M-PHY eye map measurement", "CTS analysis", "UFS verification", "eMMC protocol analysis", and supports automatic production of eye map measurement reports.
Through complete protocol capture, CTS analysis, N-PHY eye map measurement and other functions, with high-speed oscilloscope, to locate any expected data frame, in the protocol layer and physical layer analysis, can be better results to support the reliability of the product.

BGA repair is mainly used for BGA repair table as the main repair equipment, BGA repair table is mainly used for chip welding, supporting BGA, PGA, POP, QFN, SOT, PLCC, TSOP, TQFP, TDFN and other packages.

By using optical alignment, precise chip mounting alignment, synchronous movement of upper and lower heating temperature zones, rapid identification of heating position, independent temperature control of three temperature zones, accurate temperature control and other functions, BGA maintenance is more accurate and reliable.