MCP
Using NAND and LPDDR4/4X multi-chip package, reduce system development time and PCB board area, effectively reduce signal interference, and stabilize data transmission rate.
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产品参数
产品特性
产品参数
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产品特性
Subsize
Packaging multiple chips in a compact package reduces the size of the device
Reliability
Improve chip stability and durability
High performance
LPDDR4X speeds up to 4266Mbps
Low power consumption
Optimize energy distribution between chips to reduce overall power consumption
