Capacity covers 4GB-8GB, 315ball standard package, product selection of wafer categories, industrial/vehicle scale package design and high-reliability material selection, strict screening of the production line, 100% three-temperature test, product consistency.
| Product type | Product model | Capacity | Bit width | Speed | Encapsulation mode | Voltage | Temperature (℃) |
| LPDDR5/5X |
ATL5X4G32M7E-31IT |
4GB |
x32 | 6400Mbps | FBGA 315-ball |
1.8/1.05/0.9/0.5or0.3V |
-40 ~ 95 |
| LPDDR5/5X | ATL5X6G32M8E-31IT | 6GB | x32 | 6400Mbps | FBGA 315-ball | 1.8/1.05/0.9/0.5or0.3V | -40 ~ 95 |
| LPDDR5/5X | ATL5X8G32M7E-31IT | 8GB | x32 | 6400Mbps | FBGA 315-ball | 1.8/1.05/0.9/0.5or0.3V | -40 ~ 95 |
| LPDDR5/5X | ATL5X12G32M8E-31IT | 12GB | x32 | 6400Mbps | FBGA 315-ball | 1.8/1.05/0.9/0.5or0.3V | -40 ~ 95 |
| LPDDR5/5X | ATL5X16G32M7E-31IT | 16GB | x32 | 6400Mbps | FBGA 315-ball |
1.8/1.05/0.9/0.5or0.3V |
-40 ~ 95 |