ePOP
With a self-developed flash memory controller and firmware, the controller, NAND, and LPDDR are stacked together in a single chip, achieving an ultra-high level of integration. ePOP provides both storage and DRAM support within limited PCB space, significantly saving motherboard area, simplifying system design, and enhancing the thinness, portability, and performance of mobile devices.
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Product Parameters
Product Features
Application Areas
Product Parameters
CGP
| Product type | Product model | Capacity | eMMC Capacity | eMMC Controller | DRAM Capacity | Temperature (℃) |
| ePOP |
RS77232R4M15M05G |
2+32GB |
32GB | ATM003 | 2GB | -25 ~ 85 |
| ePOP |
RS77432R4M15M05G |
4+32GB | 32GB | ATM003 | 4GB | -25 ~ 85 |
| ePOP | RS77264R4M15M05G |
2+64GB |
64GB | ATM003 | 2GB | -25 ~ 85 |
| ePOP | RS77432R4M15M05G | 4+64GB | 64GB | ATM003 | 4GB | -25 ~ 85 |
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Product Features
Strong autonomy and controllability
Self-developed eMMC flash controller
High integration
self-developed firmware
High speed data transmission
strong autonomous controllability
Good compatibility
Integrating multiple chips in a single package reduces board-to-board connectivity
Firmware upgradable
Supports high-speed data transmission
High cost performance
Conforms to the JEDEC eMMC5.1 standard protocol and is backward compatible with mainstream Host platforms
Application Areas
Smart headsets
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Smart wear
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